Additional information
| SIKA | Sika – 01 Primer Plus, Sika – MB EZ Rapid, Sika – T21, Sika Remover, Sika T25 |
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~Nationwide Shipping~With more than 100 years of experience worldwide innovation and sustainability leader in the development and production of systems and products for commercial and residential construction, as well as the transportation, marine, automotive, and renewable energy manufacturing industries.
All-in-One Wood Flooring Urethane Adhesive, Unlimited Moisture Vapor and Sound Reduction Membrane T21 is a one-component, low VOC, permanently elastic, super strong, very low permeability moisture-cure polyurethane adhesive, vapor retarding, crack bridging and sound reduction membrane all-in-one for full surface wood floor bonding. This adhesive may be used for solid and engineered wood floors (strips, longstrips, planks, panels, boards), mosaic parquet, industrial parquet, wood paving (residential) as well as chip boards and plywood. Once cured, it will generate a super strong bond to a variety of substrates for glue down installations and at the same time form a membrane which reduces moisture vapor transmission from the subfloor and sound reduction membrane.
Trowel-applied, polyurethane, Wood Flooring Adhesive T25 is a one-component, low-VOC, low odor, moisture cured polyurethane adhesive for full surface bonding of wood flooring. SikaBond®-T25 will tenaciously bond wood to most surfaces, including concrete, plywood, and leveling and patch underlayments that have been properly prepared.
One component rapid drying moisture barrier, adhesion promoter, and substrate consolidator for flooring on critical substrates One-Component, Rapid-Drying, Polyurethane Resin, Moisture Mitigation System and Substrate Solidifier. MB EZ Rapid can be used as a fast-curing moisture mitigation system for interior use only on cement-based substrates up to 98% RH or 18 lbs./1000 sq. ft./24 hrs. before applying SikaLevel® underlayments and SikaBond® adhesives. MB EZ Rapid can be used as a solidifier over a variety of critical substrates, such as adhesive residues and gypsum substrates. Moisture barrier to control moisture vapor emission rates in cementitious substrates not exceeding up to 93% RH/12 #CC as a one-coat system or above 93% RH/12 lbs./1000 sq. ft./24 hrs. up to 98% RH/18 lbs./1000 sq. ft./24 hrs. as a two-coat system.
Acrylic primer for porous substrates Level-01 Primer Plus is a one-part, water-dispersed and solvent-free, acrylic-based solution used to prime and seal floor surfaces prior to the application ofLevel products.
Water-based and solvent-free
Penetrates substrate to reduce outgassing and formation of bubbles in the underlayment
Prevents water loss from the underlayment into the substrate
For absorbent substrates
Concrete and cement screeds.
Suitable on OSB and plywood
Particularly suitable as an adhesion promoter and surface sealer beneath the Level products, enhancing the bond and integrity of the underlayment when applied onto porous substrates.
Fast drying cleaner for use with SikaBond® products.
· Ideal for SikaBond® urethane adhesives even after curing · Does not leave ghosting on wood floor finish · Leaves no residue · Low odor · Fast drying For removal of cured and uncured SikaBond® urethane adhesive from hardwood floors.
| SIKA | Sika – 01 Primer Plus, Sika – MB EZ Rapid, Sika – T21, Sika Remover, Sika T25 |
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